ICS854S013 Datasheet, PDF (1/14 Pages) Integrated Device Technology – LOW SKEW, DUAL, 1-TO-3 DIFFERENTIAL-TO-LVDS FANOUT BUFFER

PRELIMINARY
LOW SKEW, DUAL, 1-TO-3 DIFFERENTIAL-TO-LVDS
FANOUT BUFFER
ICS854S013
General Description
The ICS854S013 is a low skew, high performance
ICS
Dual 1-to-3 Differential-to-LVDS Fanout Buffer and
HiPerClockS™ _{a member of the HiPerClockS™ family of High}
Performance Clock Solutions from IDT. The PCLKx,
nPCLKx pairs can accept most standard differential
input levels. The ICS854S013 is characterized to operate from a
3.3V power supply. Guaranteed output and bank skew character-
istics make the ICS854S013 ideal for those clock distribution
applications demanding well defined performance and
repeatability.
Features
• Two differential LVDS output banks
• Two differential clock input pairs
• PCLKx, nPCLKx pairs can accept the following differential
input levels: LVPECL, LVDS, CML, SSTL
• Maximum output frequency: >3GHz
• Translates any single ended input signal to LVDS levels with
resistor bias on nPCLKx input
• Output skew: <25ps (typical)
• Bank skew: <50ps (typical)
• Propagation delay: TBD
• Additive phase jitter, RMS: 0.15ps (typical)
• Full 3.3V power supply
• 0°C to 70°C ambient operating temperature
• Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
Block Diagram
PCLKA ^Pulldown
nPCLKA ^Pullup
PCLKB ^Pulldown
nPCLKB ^Pullup
QA0
nQA0
QA1
nQA1
QA2
nQA2
QB0
nQB0
QB1
nQB1
QB2
nQB2
Pin Assignment
nQA0 1
QA0 2
VDD 3
PCLKA 4
nPCLKA 5
PCLKB 6
nPCLKB 7
VDD 8
nQB0 9
QB0 10
20 QA1
19 nQA1
18 QA2
17 nQA2
16 VDD
15 QB2
14 nQB2
13 QB1
12 nQB1
11 GND
ICS854S013
20-Lead TSSOP
6.5mm x 4.4mm x 0.925mm package body
G Package
Top View
The Preliminary Information presented herein represents a product in pre-production. The noted characteristics are based on initial product characterization and/or qualification.
Integrated Device Technology, Incorporated (IDT) reserves the right to change any circuitry or specifications without notice.
IDT™ / ICS™ LVDS FANOUT BUFFER
1
ICS854S013BG REV. A FEBRUARY 26, 2008