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ICS85105I Datasheet, PDF (1/16 Pages) Integrated Device Technology – LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER
LOW SKEW, 1-TO-5, DIFFERENTIAL/
LVCMOS-TO-0.7V HCSL FANOUT BUFFER
ICS85105I
GENERAL DESCRIPTION
The ICS85105I is a low skew, high performance 1-
ICS
to-5 Differential-to-0.7V HCSL Fanout Buffer and
HiPerClockS™ a member of the HiPerClockS™ family of High
Perfor mance Clock Solutions from IDT. The
ICS85105I has two selectable clock inputs. The
CLK0, nCLK0 pair can accept most standard differential
input levels. The single-ended CLK1 can accept LVCMOS or
LVTTL input levels. The clock enable is internally synchronized
to eliminate runt clock pulses on the outputs during asynchro-
nous assertion/deassertion of the clock enable pin.
Guaranteed output and part-to-part skew characteristics make
the ICS85105I ideal for those applications demanding well
defined performance and repeatability.
FEATURES
• Five 0.7V differential HCSL outputs
• Selectable differential CLK0, nCLK0 or LVCMOS inputs
• CLK0, nCLK0 pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL
• CLK1 can accept the following input levels:
LVCMOS or LVTTL
• Maximum output frequency: 500MHz
• Translates any single-ended input signal to 3.3V
HCSL levels with resistor bias on nCLK input
• Output skew: 100ps (maximum)
• Part-to-part skew: 600ps (maximum)
• Propagation delay: 3.2ns (maximuml)
• Additive phase jitter, RMS: 0.24ps (typical)
• 3.3V operating supply
• -40°C to 85°C ambient operating temperature
• Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
BLOCK DIAGRAM
CLK_EN Pullup
CLK0 Pulldown
nCLK0 Pullup/Pulldown
0
CLK1 Pulldown
1
CLK_SEL Pulldown
IREF
D
Q
LE
PIN ASSIGNMENT
GND 1 20 Q0
CLK_EN 2 19 nQ0
CLK_SEL 3
CLK0 4
18 VDD
17 Q1
nCLK0 5 16 nQ1
Q0
nQ0
CLK1 6
Q4 7
15 Q2
14 nQ2
Q1
nQ4 8
13 VDD
nQ1
IREF 9 12 Q3
VDD 10 11 nQ3
Q2
nQ2
ICS85105I
Q3
20-Lead TSSOP
nQ3
6.5mm x 4.4mm x 0.925mm Package Body
G Package
Q4
nQ4
Top View
IDT™ / ICS™ 0.7V HCSL FANOUT BUFFER
1
ICS85105AGI REV. A JUNE 5, 2008