IC-HGP Datasheet, PDF (5/20 Pages) IC-Haus GmbH – 3A HIGH-SIDE LASER SWITCH

iC-HGP
3 A HIGH-SIDE LASER SWITCH
preliminary
Rev A1, Page 5/20
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item Symbol Parameter
No.
Conditions
G001 VDD
Voltage at VDD
G002 I(VDD) Current in VDD
G003 V(VBL) Voltage at VBL12, VBL34, VBL56
G004 I(VBL)
Current in VBL12, VBL34, VBL56
DC current
G005 V(VNBL) Voltage at VNBL12, VNBL34, VNBL56 VBL < 6 V
VBL > 6 V
G006 I(VNBL) Current in VBL12, VBL34, VBL56
DC current
G007 V(CI)
Voltage at CI1. . . 6
G008 V()
Voltage at EN1. . . 6, ELVDS, NER
G009 V(LDA) Voltage at LDA1. . . 6
G010 I(LDA) Current in LDA1. . . 6
DC current
G011 I()
Current in CI1. . . 6, EN1. . . 6, ELVDS
G012 I(NER) Current in NER
G013 Vd()
ESD Susceptibility at all pins
HBM 100 pF discharged through 1.5 kΩ
G014 Tj
Operating Junction Temperature
G015 Ts
Storage Temperature Range
Min.
Unit
Max.
-0.3
6
V
-10
50
mA
-0.3
12
V
-10
1200 mA
-0.3 VBL + 0.3 V
VBL − 6 VBL + 0.3 V
-10
10
mA
-0.3
6
V
-0.3
6
V
-0.3
12
V
-600
10
mA
-10
10
mA
-10
20
mA
2
kV
-40
125
°C
-40
150
°C
THERMAL DATA
Item Symbol
No.
T01 Ta
T02 Rthja
T03 RthjTP
Parameter
Conditions
Operating Ambient Temperature Range
(extended range on request)
Thermal Resistance Chip/Ambient
Mounted onto the Evaluation Board HGP1D
Thermal Resistance Chip/Thermal Pad
Unit
Min. Typ. Max.
-25
85 °C
25
K/W
4
K/W
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.