IC-HGP Datasheet, PDF (3/20 Pages) IC-Haus GmbH – 3A HIGH-SIDE LASER SWITCH

iC-HGP
3 A HIGH-SIDE LASER SWITCH
preliminary
PACKAGING INFORMATION QFN32 5 mm x 5 mm to JEDEC
Rev A1, Page 3/20
PIN CONFIGURATION QFN32 5 mm x 5 mm
32 31 30 29 28 27 26 25
1
24
2
23
3
22
4
21
5
<P-CODE>
20
6
<A-CODE>
19
7
<D-CODE>
18
8
17
9 10 11 12 13 14 15 16
PIN FUNCTIONS
No. Name Function
1 CI1
Current control voltage channel 1
2 CI2
Current control voltage channel 2
3 CI3
Current control voltage channel 3
4 GND Ground
5 CI4
Current control voltage channel 4
6 CI5
Current control voltage channel 5
7 CI6
Current control voltage channel 6
8 VBL12 Laser supply voltage channel 1 and 2
9 VNBL12 Supply voltage channel 1 and 2
PIN FUNCTIONS
No. Name Function
10 VBL12 Laser supply voltage channel 1 and 2
11 VBL34 Laser supply voltage channel 3 and 4
12 VNBL34 Supply voltage channel 3 and 4
13 VBL34 Laser supply voltage channel 3 and 4
14 VBL56 Laser supply voltage channel 5 and 6
15 VNBL56 Supply voltage channel 5 and 6
16 VBL56 Laser supply voltage channel 5 and 6
17 EN6 TTL switching input channel 6
Negative LVDS Input channel 5 and 6
18 EN5 TTL switching input channel 5
Positive LVDS Input channel 5 and 6
19 EN4 TTL switching input channel 4
Negative LVDS Input channel 3 and 4
20 EN3 TTL switching input channel 3
Positive LVDS Input channel 3 and 4
21 GND Ground
22 ELVDS TTL/LVDS Fast/Slow Input selector
23 VDD Supply voltage
24 EN2 TTL switching input channel 2
Negative LVDS Input channel 1 and 2
25 EN1 TTL switching input channel 1
Positive LVDS Input channel 1 and 2
26 LDA6 Laser diode anode channel 6
27 LDA5 Laser diode anode channel 5
28 LDA4 Laser diode anode channel 4
29 LDA3 Laser diode anode channel 3
30 LDA2 Laser diode anode channel 2
31 LDA1 Laser diode anode channel 1
32 NER Error monitor output
TP
Thermal Pad (GND)
The Thermal Pad is to be connected to a Ground Plane (GND) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation ( HGP label and coding is subject
to change).