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ICE30N160 Datasheet, PDF (2/9 Pages) Icemos Technology – Enhancement Mode MOSFET
Preliminary Data Sheet
ICE30N160
Parameter
Symbol
Conditions
Thermal characteristics
Thermal resistance, junction-
case a
RthJC
Thermal resistance, junction-
ambient a
RthJA
Soldering temperature, wave
soldering only allowed at leads
T sold
leaded
1.6mm (0.063in.) from
case for 10 s
Values
Unit
Min Typ Max
-
- 0.6
oC/W
-
- 62
-
- 260 oC
Electrical characteristics b , at Tj=25oC, unless otherwise specified
Static characteristics
Drain-source breakdown voltage V(BR)DSS
Gate threshold voltage
VGS(th)
Zero gate voltage drain current IDSS
Gate source leakage current
Drain-source
on-state resistance
IGSS
RDS (on)
VGS=0 V, ID=250µA
VDS=VGS, ID=250µA
VDS=300V, VGS=0V,
Tj=25oC
VDS=300V, VGS=0V,
Tj=150oC
VGS=±20 V, VDS=0V
VGS=10V, ID=11A,
Tj=25oC
VGS=10V, ID=11A,
Tj=150oC
300 -
-
V
2.5 3 3.5
-
0.1 1
µA
-
- 100
-
- 100 nA
- 0.13 0.16
Ω
- 0.35 -
Gate resistance
RG
f=1 MHZ, open drain
-
4
-
Ω
Dynamic characteristics
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance Crss
VGS=0 V, VDS=25 V,
f=1 MHz
- 2750 -
- 980 -
pF
-
25 -
Transconductance
gfs
VDS>2*ID*RDS, ID=11A
-
23 -
S
Turn-on delay time
td(on)
-
10 -
Rise time
Turn-off delay time
tr
td(off)
VDS=150V, VGS=10V,
-
ID=22A, RG=4Ω (External) -
5
-
67 -
ns
Fall time
tf
-
4.5 -
SP-30N160-000-0
10/11/2013
2