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HYMP112S64MP8 Datasheet, PDF (9/17 Pages) Hynix Semiconductor – DDR2 SDRAM SO-DIMM
Output Buffer Levels
Output AC Test Conditions
Symbol
VOH
VOL
VOTR
Parameter
Minimum Required Output Pull-up under AC Test Load
Maximum Required Output Pull-down under AC Test Load
Output Timing Measurement Reference Level
1. The VDDQ of the device under test is referenced.
HYMP112S64(L)MP8
SSTL_18 Class II
VTT + 0.603
VTT - 0.603
0.5 * VDDQ
Units
V
V
V
Notes
1
Output DC Current Drive
Symbol
Parameter
SSTl_18 Class II
Units
Notes
IOH(dc) Output Minimum Source DC Current
- 13.4
mA
1, 3, 4
IOL(dc) Output Minimum Sink DC Current
13.4
mA
2, 3, 4
1. VDDQ = 1.7 V; VOUT = 1420 mV. (VOUT - VDDQ)/IOH must be less than 21 ohm for values of VOUT between VDDQ and VDDQ - 280 mV.
2. VDDQ = 1.7 V; VOUT = 280 mV. VOUT/IOL must be less than 21 ohm for values of VOUT between 0 V and 280 mV.
3. The dc value of VREF applied to the receiving device is set to VTT
4. The values of IOH(dc) and IOL(dc) are based on the conditions given in Notes 1 and 2. They are used to test device drive current
capability to ensure VIH min plus a noise margin and VIL max minus a noise margin are delivered to an SSTL_18 receiver. The actual
current values are derived by shifting the desired driver operating point (see Section 3.3) along a 21 ohm load line to define a
convenient driver current for measurement.
OCD defalut characteristics
Description
Parameter
Output impedance
Pull-up and pull-down mismatch
Output slew rate
Sout
Min
12.6
0
1.5
Nom
18
-
Max
23.4
4
5
Unit
ohms
ohms
V/ns
Notes
1,2
1,2,3
1,4,5,6
Note:
1. Absolute Specifications (0°C ≤ TCASE ≤ +95°C; VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V)
2. Impedance measurement condition for output source dc current: VDDQ = 1.7V; VOUT = 1420mV; (VOUT-VDDQ)/Ioh must be less
than 23.4 ohms for values of VOUT between VDDQ and VDDQ-280mV. Impedance measurement condition for output sink dc current:
VDDQ = 1.7V; VOUT = 280mV; VOUT/Iol must be less than 23.4 ohms for values of VOUT between 0V and 280mV.
3. Mismatch is absolute value between pull-up and pull-dn, both are measured at same temperature and voltage.
4. Slew rate measured from vil(ac) to vih(ac).
5. The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate as measured from AC to AC.
6. DRAM output slew rate specification applies to 400MT/s & 533MT/s speed bins. Output slew rate at 667&800MT/s will be added with
JEDEC process.
Rev. 0.1/ July 2004
9