HYMD564M646A8-J Datasheet, PDF (11/17 Pages) Hynix Semiconductor – Unbuffered DDR SO-DIMM

SERIAL PRESENCE DETECT
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
- continued -
Parameter
Write DQS High Level Width
Write DQS Low Level Width
Clock to First Rising edge of DQS-In
Data-In Setup Time to DQS-In (DQ & DM)
Data-in Hold Time to DQS-In (DQ & DM)
DQ & DM Input Pulse Width
Read DQS Preamble Time
Read DQS Postamble Time
Write DQS Preamble Setup Time
Write DQS Preamble Hold Time
Write DQS Postamble Time
Mode Register Set Delay
Exit Self Refresh to Any Execute Command
Average Periodic Refresh Interval
Symbol
tDQSH
tDQSL
tDQSS
tDS
tDH
tDIPW
tRPRE
tRPST
tWPRES
tWPREH
tWPST
tMRD
tXSC
tREFI
-J(DDR333)
Min Max
0.35
-
0.35
-
0.75 1.25
0.45
-
0.45
-
1.75
-
0.9
1.1
0.4
0.6
0
-
0.25
-
0.4
0.6
2
-
200
-
-
7.8
-K(DDR266A)
Min Max
0.35
-
0.35
-
0.75 1.25
0.5
-
0.5
-
1.75
-
0.9
1.1
0.4
0.6
0
-
0.25
-
0.4
0.6
2
-
200
-
-
7.8
-H(DDR266B)
Unit Note
Min Max
0.35
-
CK
0.35
-
CK
0.75 1.25 CK
0.5
-
ns
6,7,
11~13
0.5
-
ns
6,7,
11~13
1.75
-
ns
0.9
1.1 CK
0.4
0.6 CK
0
-
CK
0.25
-
CK
0.4
0.6 CK
2
-
CK
200
-
CK
8
-
7.8 us
Note :
1. This calculation accounts for tDQSQ(max), the pulse width distortion of on-chip circuit and jitter.
2. Data sampled at the rising edges of the clock : A0~A12, BA0~BA1, CKE, /CS, /RAS, /CAS, /WE.
3. For command/address input slew rate >=1.0V/ns
4. For command/address input slew rate >=0.5V/ns and <1.0V/ns
This derating table is used to increase tIS/tIH in case where the input slew-rate is below 0.5V/ns.
Input Setup / Hold Slew-rate Derating Table.
Input Setup / Hold Slew-rate
Delta tIS
Delta tIH
V/ns
ps
ps
0.5
0
0
0.4
+50
0
0.3
+100
0
5. CK, /CK slew rates are >=1.0V/ns
6. These parameters guarantee device timing, but they are not necessarily tested on each device, and they may be guaranteed by
design or tester correlation
7. Data latched at both rising and falling edges of Data Strobes(LDQS/UDQS) : DQ, LDM/UDM.
8. Minimum of 200 cycles of stable input clocks after Self Refresh Exit command, where CKE is held high, is required to complete
Self Refresh Exit and lock the internal DLL circuit of DDR SDRAM.
9. Min (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this
value can be greater than the minimum specification limits for tCL and tCH).
10. tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCH, tCL). tQHS consists of
tDQSQmax, the pulse width distortion of on-chip clock circuits, data pin to pin skew and output pattern effects and p-channel to
n-channel variation of the output drivers.
Rev. 0.2 / Apr. 2004
11