AMMC-3040 Datasheet, PDF (6/6 Pages) Agilent(Hewlett-Packard) – 18-36 GHz Double-Balanced Mixer with Integrated LO Amplifier/Multiplier

Assembly Techniques
The backside of the AMMC- 3040
chip is RF ground. For
microstripline applications, the
chip should be attached directly
to the ground plane (e.g., circuit
carrier or heatsink) using
electrically conductive epoxy^[1].
For best performance, the
topside of the MMIC should be
brought up to the same height
as the circuit surrounding it.
This can be accomplished by
mounting a gold plated metal
shim (same length and width as
the MMIC) under the chip,
which is of the correct
thickness to make the chip and
adjacent circuit coplanar.
The amount of epoxy used for
chip and or shim attachment
should be just enough to
provide a thin fillet around the
bottom perimeter of the chip or
shim. The ground plane should
be free of any residue that may
jeopardize electrical or
mechanical attachment.
For use on coplanar circuits,
the chip can be mounted
directly on the topside ground
plane of the circuit as long as
care is taken to ensure
adequate heat sinking. Multiple
vias underneath the chip will
significantly improve heat
conduction.
The location of the RF, LO, and
IF bond pads is shown in
Figure 15. Note that all RF
input and output ports are in a
Ground- Signal- Ground
configuration. The IF port is
located near the middle of the
die, which allows for maximum
layout flexibility since the IF
connection can be made from
either side of the chip.
RF connections should be kept
as short as reasonable to
minimize performance
degradation due to series
inductance. A single bond wire
is sufficient for all signal
connections. However, double-
bonding with 0.7 mil gold wire
or the use of gold mesh^[2] is
recommended for best
performance, especially near the
high end of the frequency range.
Thermosonic wedge bonding is
the preferred method for wire
attachment to the bond pads.
Gold mesh can be attached
using a 2 mil round tracking
tool and a tool force of
approximately 22 grams with an
ultrasonic power of roughly 55
dB for a duration of 76 ± 8 mS.
A guided wedge at an ultrasonic
power level of 64 dB can be
used for the 0.7 mil wire. The
recommended wire bond stage
temperature is 150 ± 2° C.
Caution should be taken to not
exceed the Absolute Maximum
Ratings for assembly
temperature and time.
The chip is 100 µm thick and
should be handled with care.
This MMIC has exposed air
bridges on the top surface and
should be handled by the edges
or with a custom collet (do not
pick up die with vacuum on die
center.)
This MMIC is also static
sensitive and ESD handling
precautions should be taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is
recommended.
2. Buckbee-Mears Corporation, St. Paul, MN,
800-262-3824
Ordering Information:
AMMC-3040-W10 = waffle pack, 10
devices per tray
AMMC-3040-W50 = waffle pack, 50
devices per tray
www.agilent.com/
semiconductors
For product information and a complete list of
distributors, please go to our web site.
Data subject to change.
Copyright  2004 Agilent Technologies, Inc.
February 12, 2004
5989-0528EN