HCPL-7723 Datasheet, PDF (5/12 Pages) Agilent(Hewlett-Packard) – 50 MBd 2 ns PWD High Speed CMOS Optocoupler

Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. _PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Regulatory Information
The HCPL-7723/0723 will be
approved by the following
organizations:
UL
Recognized under UL1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
VDE
(HCPL-7723 option 060)
Approved according to VDE
0884/06.92, File 6591-23-4880-
1005.
TUV Rheinland
(HCPL-0723 Option 060)
Approved according to VDE
0884/06.92, Certificate
R9650938.
Insulation and Safety Related Specifications
Value
Parameter
Symbol 7723 0723
Minimum External Air Gap
(Clearance)
L(I01) 7.1 4.9
Minimum External Tracking
(Creepage)
L(I02) 7.4 4.8
Minimum Internal Plastic Gap
(Internal Clearance)
0.08 0.08
Units
mm
mm
mm
Tracking Resistance
CTI
(Comparative Tracking Index)
Isolation Group
≥ 175 ≥ 175 Volts
IIIa IIIa
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
5