HCPL-J314 Datasheet, PDF (4/17 Pages) Agilent(Hewlett-Packard) – 0.4 Amp Output Current IGBT Gate Drive Optocoupler

4
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. _PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-J314 has been
approved by the following
organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
UL
Approval under UL 1577,
component recognition program
up to V_ISO = 3750 V_rms. File
E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
t_p
T_p
T_L ^{217 °C}
260 +0/-5 °C
RAMP-UP
3 °C/SEC. MAX.
T_smax ^{150 - 200 °C}
T_smin
t_s
PREHEAT
t_L
60 to 180 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T_smax = 200 °C, T_smin = 150 °C