HCPL-540X Datasheet, PDF (4/12 Pages) Agilent(Hewlett-Packard) – Hermetically Sealed, Very High Speed, Logic Gate Optocouplers

Leaded Device Marking
Leadless Device Marking
HP LOGO
HP P/N
DESC SMD*
DESC SMD*
PIN ONE/
ESD IDENT
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
* 50434
COMPLIANCE INDICATOR,*
HP LOGO
DATE CODE, SUFFIX (IF NEEDED)
HP P/N
PIN ONE/
COUNTRY OF MFR.
ESD IDENT
HP FSCN*
COUNTRY OF MFR.
HP QYYWWZ
XXXXXX
* XXXX
XXXXXX
USA 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DESC SMD*
DESC SMD*
HP FSCN*
* QUALIFIED PARTS ONLY
* QUALIFIED PARTS ONLY
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200 Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead
finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details). This option has solder dipped leads.
5.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
5.57 (0.180)
MAX.
1-527