HCPL-540X Datasheet, PDF (3/12 Pages) Agilent(Hewlett-Packard) – Hermetically Sealed, Very High Speed, Logic Gate Optocouplers

Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
1
V_CC 8
2
V_{E 7}
3
6
V_O
4
5
GND
8 Pin DIP
Through Hole
2 Channels
1
V_CC 8
V_O1
2
7
V_O2
3
6
4
5
GND
20 Pad LCCC
Surface Mount
2 Channels
15
V_CC2
19
V_O2
13
20
GND₂ ¹²
2
V_O1^{VCC1 10}
3
GND₁
78
Note: All DIP devices have common V_CC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with
separate V_CC and ground connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
1.78 (0.070)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
1-526