HX6228 Datasheet, PDF (12/12 Pages) Honeywell Solid State Electronics Center – 128K x 8 STATIC RAM-SOI HX6228

HX6228
DYNAMIC BURN-IN DIAGRAM*
VDD
F17
F16
F7
F6
F5
F4
F3
F2
F8
F13
F14
F1
F1
F1
1 _NC
R ² A16
R ³ A14
R ⁴ A12
R
5 _A7
R
6 _A6
R
7 _A5
R
8 _A4
R
9 _A3
R ¹⁰ A2
R ¹¹ A1
R ^{12 A0}
R ¹³ DQ0
R ¹⁴ DQ1
R ^{15 DQ2}
16 _VSS
VDD ³²
A15 ³¹ R
CE ³⁰
R
NWE ²⁹ R
A13 ²⁸ R
A8 ²⁷
R
A9 ²⁶
R
A11 ²⁵ R
NOE ²⁴ R
A10 ²³ R
NCS ²² R
DQ7 ²¹ R
DQ6 ²⁰ R
DQ5 ¹⁹ R
DQ4 ¹⁸ R
DQ3 ¹⁷ R
F18
F19
F0
F15
F12
F11
F10
F19
F9
F19
F1
F1
F1
F1
F1
STATIC BURN-IN DIAGRAM*
VDD
NC ¹ NC
R ^{2 A16}
R ^{3 A14}
R ^{4 A12}
R
5 _A7
R
6 _A6
R
7 _A5
R
8 _A4
R
9 _A3
R ^{10 A2}
R ^{11 A1}
R ¹² A0
R ^{13 DQ0}
R ^{14 DQ1}
R ¹⁵ DQ2
16 _VSS
VDD ³²
A15 ^{31 R}
CE ³⁰ R
NWE ²⁹ R
A13 ²⁸ R
A8 ²⁷ R
A9 ²⁶ R
A11 ^{25 R}
NOE ^{24 R}
A10 ^{23 R}
NCS ²² R
DQ7 ²¹ R
DQ6 ^{20 R}
DQ5 ¹⁹ R
DQ4 ¹⁸ R
DQ3 ^{17 R}
VDD = 5.6V, R ≤ 10 KΩ, VIH = VDD, VIL = VSS
Ambient Temperature ≥ 125 °C, F0 ≥ 100 KHz Sq Wave
Frequency of F1 = F0/2, F2 = F0/4, F3 = F0/8, etc.
VDD = 5.5V, R ≤ 10 KΩ
Ambient Temperature ≥ 125 °C
*40-Lead Flat Pack burn-in diagrams have similar connections and are available upon request.
ORDERING INFORMATION (1)
H
X
6228
T
S
R
C
PART NUMBER
PROCESS
X=SOI
SCREEN LEVEL
V=QML Class V
Q=QML Class Q
S=Level S
B=Level B
E=Engr Device (2)
SOURCE
H=HONEYWELL
PACKAGE DESIGNATION
T=32-Lead FP
A=40-Lead FP
K=Known Good Die
- =Bare die (No Package)
TOTAL DOSE
INPUT
HARDNESS
BUFFER TYPE
R=1x10⁵ rad(SiO₂) C=CMOS Level
F=3x10⁵ rad(SiO₂)
T=TTL Level
H=1x10⁶ rad(SiO )
2
N=No Level Guaranteed
(1) Orders may be faxed to 612-954-2051. For technical assistance, contact our Customer Logistics Department at 612-954-2888.
(2) Engineering Device description: Parameters are tested from -55 to 125°C, 24 hr burn-in, IDDSB = 10mA, no radiation guaranteed.
Contact Factory with other needs.
To learn more about Honeywell Solid State Electronics Center,
visit our web site at http://www.ssec.honeywell.com
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any liability
arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
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