HMC414MS8G_01 Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – GaAs InGaP HBT MMIC POWER AMPLIFIER, 2.2 - 2.8 GHz

v01.1201
MICROWAVE CORPORATION
HMC414MS8G
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 2.2 - 2.8 GHz
Evaluation PCB for HMC414MS8G
1
* For 5V operation on Vctl line,
select R1, R2 such that 3.6V is
presented on Pins 6 and 8.
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the
ground plane similar to that shown. A sufficient number of VIA holes should be used to connect the top and
bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation
circuit board shown is available from Hittite upon request.
List of Material
Item
Description
J1 - J2
PC Mount SMA RF Connector
J3
2 mm DC Header
C1
2.7 pF Capacitor, 0603 Pkg.
C2
100 pF Capacitor, 0402 Pkg.
C3 - C6
330 pF Capacitor, 0603 Pkg.
C7
2.2 µF Capacitor, Tantalum
L1
18nH Inductor 0603 Pkg.
U1
HMC414MS8G Amplifier
PCB*
105074 Eval Board
* Circuit Board Material: Rogers 4350
1 - 220
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Visit us at www.hittite.com, or Email at [e-mail]