HMC464LP5 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – GaAs PHEMT MMIC POWER AMPLIFIER, 2.0 - 20.0 GHz

v00.0304
MICROWAVE CORPORATION
HMC464LP5
GaAs PHEMT MMIC
POWER AMPLIFIER, 2.0 - 20.0 GHz
Outline Drawing
8
Pad Descriptions
Pad Number
Function
5
RFIN
15
Vgg1
21
RFOUT & Vdd
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS
3. DIE THICKNESS IS 0.004 (0.100)
4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE
5. BACKSIDE METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. BOND PAD METALIZATION: GOLD
Description
This pin is AC coupled and matched to 50 Ohms
from 2.0 - 20.0 GHz
Gate Control for amplifier. Adjust between -2 to 0V
to achieve Idd= 290 mA.
Interface Schematic
RF output for amplifier. Connect the DC
bias (Vdd) network to provide drain current (Idd).
See application circuit herein.
30
Vgg2
Control voltage for amplifier. +3V should be applied to
Vgg2 for nominal operation.
Ground
Paddle
1-4, 6-14,
16-20, 22-29,
31, 32
GND
N/C
Ground paddle must be connected to RF/DC ground.
No connection. These pins may be connected to RF ground.
Performance will not be affected.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order Online at www.hittite.com
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