FH28 Datasheet, PDF (9/11 Pages) Hirose Electric – 0.5 mm Pitch, 2.55 mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors

FH28 Seriesq0.5 mm Pitch, 2.55 mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
sRecommended Temperature Profile
250
200
(ç)
150
100
150ç
200ç
MAX 250ç
230ç
50
25ç _{(60sec.) 90 sec. to 120 sec.}
(60sec.)
0
Preheating
Soldering
Start
60
120
Time (Seconds)
HRS test condition
Solder method
:Reflow, IR
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s Part
Number:M705-221CM5-32-10.5)
Test board
:Glass epoxy
55mm∞150mm∞1.6mm thick
Land,Metal mask dimensions : Our recommendations
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and
board size/thickness. Consult your solder paste and
equipment manufacturer for specific recommendations.
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