FH27-10S-0.4SH Datasheet, PDF (8/8 Pages) Hirose Electric – 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors

BFPC Construction (Recommended Specifications)
1. Using Single-sided FPC
Top side
Bottom side
Material Name
Material
Covering layer film
Polyamide 1 mil thick.
Cover adhesive
Surface treatment
Tin-lead plated
Copper foil
Cu
1/2oz
Base adhesive
Base film
Polyamide 1 mil thick
Reinforcement material adhesive Thermosetting adhesive
Stiffener
Polyamide 3 mil thick
Total
Thickness (µm)
25
25
5
35
25
25
30
75
195
2. Using Double-sided FPC
Top side
Bottom side
Material Name
Material
Covering layer film
Polyamide 1 mil thick
Cover adhesive
Surface treatment
Tin-lead plated
Through-hole copper
Cu
Copper foil
Cu
1/2oz
Base adhesive
Base film
Polyamide 1 mil thick
Base adhesive
Copper foil
Cu
1/2oz
Cover adhesive
Covering layer film
Polyamide 1 mil thick
Reinforcement material adhesive Thermosetting adhesive
Stiffener
Polyamide 1 mil thick
Total
Thickness (µm)
25
25
5
15
18
18
25
18
18
25
25
25
25
199
To prevent release of the lock due to FPC bending, use of the FPC with copper foil on bottom side is not recommended.
®
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: [phone], FAX: [phone]
http://www.hirose.com
http://www.hirose-connectors.com
The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.
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