FH27-10S-0.4SH Datasheet, PDF (7/8 Pages) Hirose Electric – 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors

BRecommended Temperature Profile
qUsing Typical Solder Paste
5 sec. max.
250
240ç
200
200ç
150
150ç
160ç
100
50
(30 sec.)
25ç _{(60sec.) 90 sec. to 120 sec.}
(20 sec. to 30 sec.)
0
Start
Preheating
Soldering
Time (Seconds)
HRS test conditions
Solder method :Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s Part
SENSBY NR-2)
Environment
:Room air
Solder composition :Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s Part Number:
OZ63-201C-50-9)
Test board
:Glass epoxy 40mm∞100mm∞1.6mm thick
Land dimensions:0.23mm∞0.8mm
Metal mask
:0.2∞0.8∞0.12mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
qUsing Lead-free Solder Paste
250
200
200ç
MAX 250ç
230ç
150
150ç
100
50
25ç _{(60sec.) 90 sec. to 120 sec.}
0
Start
Preheating
(60 sec.)
Soldering
Time (Seconds)
HRS test condition
Solder method :Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s Part Number:
SENSBY NR-2)
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s Part Number:
M705-221CM5-42-10.5)
Test board
:Glass epoxy 70mm∞80mm∞1.6mm thick
Land dimensions:0.23mm∞08mm
Metal mask
:0.2∞0.8∞0.12mm thick
The temperature profiles shown are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board size
/ thickness. Consult your solder paste and equipment manufacturer
for specific recommendations.
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