FH33-28S-0.5SH Datasheet, PDF (10/16 Pages) Hirose Electric – 0.4mm,0.5mm,1mm Pitch, 1.2mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors

FH33 Seriesq0.4mm,0.5mm,1mm Pitch, 1.2mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
sRecommended Temperature Profile
qUsing Lead-free Solder paste
250
200
150
(ç)
100
50
0
150ç
200ç
MAX 250ç
230ç
HRS test conditions
Solder method : Reflow, IR/hot air
Environment : Room air
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s Part Number: M705-221CM5-32-10.5)
Test board : Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions : Contacts lead 0.3mm∞0.65mm
Metal fittings 0.55mm∞0.8mm
Metal mask : Contacts lead 0.25mm∞0.65mm∞0.1mm thick
Metal fittings 0.55mm∞0.8mm∞0.1mm thick
25ç _{(60 sec.) 90 to 120 sec.}
(60 sec.)
Start
Preheating
Sodering
Time (Seconds)
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
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