S11850-1106_15 Datasheet, PDF (9/10 Pages) Hamamatsu Corporation – CCD image sensors

CCD image sensors
S11850-1106, S11851-1106
Specifications of built-in TE-cooler (Typ., vacuum condition)
Parameter
Symbol
Condition
Specification
Unit
Internal resistance
Rint Ta=25 °C
1.6
Ω
Maximum current*¹⁴ *¹⁵
Imax Tc*¹⁶=Th*¹⁷=25 °C
1.8
A
Maximum voltage
Vmax Tc*¹⁶=Th*¹⁷=25 °C
3.5
V
Maximum heat absorption*¹⁸ Qmax
4.0
W
*14: If the current greater than this value flows into the thermoelectric cooler, the heat absorption begins to decrease due to the Joule
heat. It should be noted that this value is not the damage threshold value. To protect the thermoelectric cooler and maintain stable
operation, the supply current should be less than 60% of this maximum current.
*15: To ensure stable temperature control, ΔT (temperature difference between Th and Tc) should be less than 30 °C. If ΔT exceeds 30 °C,
product characteristics may deteriorate. For example, the dark current uniformity may degrade.
*16: Temperature of the cooling side of thermoelectric cooler
*17: Temperature of the heat radiating side of thermoelectric cooler
*18: This is a theoretical heat absorption level that offsets the temperature difference in the thermoelectric cooler when the maximum
current is supplied to the unit.
Specifications of built-in temperature sensor
A thermistor chip is built in the same package with a CCD chip, and the CCD chip temperature can be monitored with it. A relation be-
tween the thermistor resistance and absolute temperature is expressed by the following equation.
RT1 = RT2 × exp BT1/T2 (1/T1 - 1/T2)
RT1: Resistance at absolute temperature T1 [K]
RT2: Resistance at absolute temperature T2 [K]
BT1/T2: B constant [K]
The characteristics of the thermistor used are as follows.
R298=10 kΩ
B298/323=3900 K
Precautions
· If the thermoelectric cooler does not radiate away sufficient heat, then the product temperature will rise and cause physical damage
or deterioration to the product. Make sure there is sufficient heat dissipation during cooling. As a heat dissipation measure, we rec-
ommend applying a high heat-conductivity material (silicone grease, etc.) over the entire area between the product and the heat-
sink (metallic block, etc.), and screwing and securing the product to a heatsink.
· Handle these sensors with bare hands or wearing cotton gloves. In addition, wear anti-static clothing or use a wrist band with an
earth ring, in order to prevent electrostatic damage due to electrical charges from friction.
· Avoid directly placing these sensors on a work-desk or work-bench that may carry an electrostatic charge.
· Provide ground lines or ground connection with the work-floor, work-desk and work-bench to allow static electricity to discharge.
· Ground the tools used to handle these sensors, such as tweezers and soldering irons.
It is not always necessary to provide all the electrostatic measures stated above. Implement these measures according to the amount
of damage that occurs.
Related information
www.hamamatsu.com/sp/ssd/doc_en.html
Precautions
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∙ Image sensors
Technical information
∙ FFT-CCD area image sensor/Technical information
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