S8865-64G_15 Datasheet, PDF (13/15 Pages) Hamamatsu Corporation – Photodiode array combined with signal processing IC for X-ray detection

Photodiode arrays with amplifier
S8865-64G/-128G/-256G, S8866-64G-02/-128G-02
Procautions for use
(1) The signal processing IC chip is protected against static electricity. However, in order to prevent possible damage to the IC chip,
take electrostatic countermeasures such as grounding yourself, as well as workbench and tools. Also protect the IC chip from surge
voltages from peripheral equipment.
(2) Gold wires for wire bonding are very thin, so they easily break if subjected to mechanical stress. The signal processing IC chip, wire
bonding section and photodiode array chip are covered with resin for protection. However, never touch these portions. Excessive
force, if applied, may break the wires or cause malfunction.
Blow air to remove dust or debris if it gets on the protective resin. Never wash them with solvent.
Signals may not be obtained if dust or debris is left or a scratch is made on the protective resin, or the signal processing IC chip or
photodiode array chip is nicked.
(3) The photodiode array characteristics may deteriorate when operated at high humidity, so put it in a hermetically sealed enclosure or
case.
When installing the photodiode array on a board, be careful not to cause the board to warp.
(4) The characteristics of the signal processing IC chip deteriorate if exposed to X-rays. So use a lead shield which is at least 1 mm
larger all around than the signal processing IC chip. The 1 mm margin may not be sufficient depending on the incident angle of
X-rays. Provide an even larger shield as long as it does not cover the photodiode active area. Since the optimal shield thickness
depends on the operating conditions, calculate it by taking the attenuation coefficient of lead into account.
(5) The sensitivity of the photodiode array chip decreases if continuously exposed to X-rays. The extent of this sensitivity decrease
differs depending on the X-ray irradiation conditions, so before beginning measurement, check how much the sensitivity decreases
under the X-ray irradiation conditions to be used.
Driver circuit C9118 series (sold separately)
The CMOS driver circuit is designed for the S8865-64G/-128G and S8866-128G-02 photodiode arrays with amplifier.
The C9118 series operates a photodiode by just inputting two signals (M-CLK and M-RESET) and a signal +5 V supply.
The C9118 is intended for single use or parallel connections, while the C9118-01 is suitable for cascade connections.
Features
Single power supply (+5 V) operation
Operation with two input signals (M-CLK and M-RESET)
Compact: 46 × 56 × 5.2 ^t mm
13