S11106-10_15 Datasheet, PDF (11/12 Pages) Hamamatsu Corporation – CMOS linear image sensors

CMOS linear image sensors
S11106-10, S11107-10
Recommended temperature profile for reflow soldering (typical example)
300 °C
217 °C
200 °C
Peak temperature
260 °C max.
Heating
3 °C/s max.
Peak temperature - 5 °C
30 s max.
Cooling
6 °C/s max.
150 °C
Preheating
60 to 120 s
Soldering
60 to 150 s
25 °C to peak temperature
8 m max.
Time
KMPDB0405EA
∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a
humidity of 60% or less, and perform soldering within 4 weeks.
∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used.
Before actual reflow soldering, check for any problems by tesitng out the reflow soldering methods in advance.
∙ When three or more months have passed or if the packing bag has not been stored in an environment described above, perform
baking. For the baking method, see the precautons “Resin sealed type CMOS linear image sensors.”
Precautions
(1) Electrostatic countermeasures
· This device has a built-in protection circuit as a safeguard against static electrical charges. However, to prevent destroying the device
with electrostatic charges, take countermeasures such as grounding yourself, the workbench and tools.
· Protect this device from surge voltages which might be caused by peripheral equipment.
(2) Package handling
· The photosensitive area of this device is sealed and protected by transparent resin. When compared to a glass faceplate, the surface
of transparent resin may be less uniform and is more likely to be scratched. Be very careful when handling this device and also when
designing the optical systems.
· ^{Dust or grime on the light input window might cause nonuniform sensitivity. To remove dust or grime, blow it off with compressed air.}
(3) Surface protective tape
· Protective tape is affixed to the surface of this product to protect the photosensitive area. After assembling the product, remove the
tape before use.
(4) Operating and storage environments
· ^{Handle the device within the temperature range specified in the absolute maximum ratings. Operating or storing the device at an ex-}
cessively high temperature and humidity may cause variations in performance characteristics and must be avoided.
(5) UV exposure
· This product is not designed to prevent deterioration of characteristics caused by UV exposure, so do not expose it to UV light.
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