GS8182D37BD-400 Datasheet, PDF (11/27 Pages) GSI Technology – 18Mb SigmaQuad-II+ Burst of 4 SRAM

GS8182D19/37BD-435/400/375/333/300
Thermal Impedance
Package
Test PCB
Substrate
θ JA (C°/W)
Airflow = 0 m/s
θ JA (C°/W)
Airflow = 1 m/s
θ JA (C°/W)
Airflow = 2 m/s
θ JB (C°/W) θ JC (C°/W)
165 BGA
4-layer
19.1
15.9
14.9
7.2
2.3
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
HSTL I/O DC Input Characteristics
Parameter
Symbol
Min
Max
Units
Notes
DC Input Logic High
V_IH (dc)
V_REF + 0.1
V_DD + 0.3
V
1, 4
DC Input Logic Low
V_IL (dc)
–0.3
V_REF – 0.1
V
1, 3
Notes:
1. Compatible with both 1.8 V and 1.5 V I/O drivers
2. These are DC test criteria. DC design criteria is V_REF ± 50 mV. The AC V_IH/V_IL levels are defined separately for measuring timing param-
eters.
3. V_IL (Min)DC = –0.3 V, V_IL(Min)AC = –1.5 V (pulse width ≤ 3 ns).
4. V_IH (Max)DC = V_DDQ + 0.3 V, V_IH(Max)AC = V_DDQ + 0.85 V (pulse width ≤ 3 ns).
HSTL I/O AC Input Characteristics
Parameter
Symbol
Min
Max
Units
AC Input Logic High
V_IH (ac)
V_REF + 200
—
mV
AC Input Logic Low
V_IL (ac)
—
V_REF – 200
mV
V_REF Peak to Peak AC Voltage
V_REF (ac)
—
5% V_REF (DC)
mV
Notes:
1. The peak to peak AC component superimposed on V_REF may not exceed 5% of the DC component of V_REF.
2. To guarantee AC characteristics, V_IH,V_IL, Trise, and Tfall of inputs and clocks must be within 10% of each other.
3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
Notes
2, 3
2, 3
1
Rev: 1.03a 11/2011
11/27
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2008, GSI Technology