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GS72116ATP Datasheet, PDF (1/18 Pages) GSI Technology – 128K x 16 2Mb Asynchronous SRAM
GS72116ATP/J/T/U
SOJ, TSOP, FP-BGA, TQFP
128K x 16
Commercial Temp
Industrial Temp
2Mb Asynchronous SRAM
7, 8, 10, 12 ns
3.3 V VDD
Center VDD and VSS
Features
• Fast access time: 7, 8, 10, 12 ns
SOJ 128K x 16-Pin Configuration
• CMOS low power operation: 145/125/100/85 mA at
minimum cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Byte control
• Fully static operation
• Industrial Temperature Option: –40° to 85°C
• Package line up
J: 400 mil, 44-pin SOJ package
TP: 400 mil, 44-pin TSOP Type II package
T: 10 mm x 10 mm, 44-pin TQFP
U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
Description
A4
1
A3
2
A2
3
A1
4
A0
5
Top view
CE
6
DQ1
7
DQ2
8
DQ3
9
DQ4
10
VDD
11
44-pin
VSS
12
SOJ
DQ5
13
DQ6
14
DQ7
15
44
A5
43
A6
42
A7
41
OE
40
UB
39
LB
38
DQ16
37
DQ15
36
DQ14
35
DQ13
34
VSS
33
VDD
32
DQ12
31
DQ11
30
DQ10
The GS72116A is a high speed CMOS Static RAM organized
as 131,072 words by 16 bits. Static design eliminates the need
for external clocks or timing strobes. The GS operates on a sin-
gle 3.3 V power supply and all inputs and outputs are TTL-
compatible. The GS72116A is available in a 6 mm x 8 mm
Fine Pitch BGA package, a 10 mm x 10 mm TQFP package, as
well as in 400 mil SOJ and 400 mil TSOP Type-II packages.
DQ8
16
WE
17
A15
18
A14
19
A13
20
A12
21
A16
22
29
DQ9
28
NC
27
A8
26
A9
25
A10
24
A11
23
NC
Package J
Pin Descriptions
Symbol
A0–A16
DQ1–DQ16
CE
LB
UB
WE
OE
VDD
VSS
NC
Description
Address input
Data input/output
Chip enable input
Lower byte enable input
(DQ1 to DQ8)
Upper byte enable input
(DQ9 to DQ16)
Write enable input
Output enable input
+3.3 V power supply
Ground
No connect
Rev: 1.04a 10/2002
1/18
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.