MB39C007 Datasheet, PDF (9/52 Pages) Fujitsu Component Limited. – 2 ch DC/DC Converter IC Built-in Switching FET & voltage detection function, PFM/PWM Synchronous Rectification, and Down Conversion Support

MB39C007
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rating
Unit
Min
Max
Power supply voltage
VDD AVDD = DVDD1 = DVDD2
−0.3
+6.0
V
OUT1, OUT2 pins
−0.3
VDD + 0.3
Signal input voltage
CTLP, CTL1, CTL2,
VISIG
MODE1, MODE2 pins
−0.3
VREFIN1, VREFIN2 pins
−0.3
VDD + 0.3
V
VDD + 0.3
VDET pin
−0.3
VDD + 0.3
XPOR pull-up voltage
VIXPOR XPOR pin
−0.3
+6.0
V
LX voltage
VLX
LX1, LX2 pins
−0.3
VDD + 0.3
V
LX Peak current
IPK
The upper limit value of ILX1
and ILX2
⎯
1.8
A
Power dissipation
Ta ≤ +25 °C
PD
Ta = +85 °C
⎯
3125*¹, *², *³
mW
⎯
1563*¹, *², *⁴
⎯
1250*¹, *², *³
mW
⎯
625*¹, *², *⁴
Operating ambient
temperature
Ta
⎯
−40
+85
°C
Storage temperature
TSTG
⎯
−55
+125
°C
*1 : See the diagram of “■ EXAMPLE OF STANDARD OPERATION CHARACTERISTICS. Power dissipation vs.
Operating ambient temperature” for the package power dissipation of Ta from + 25 °C to + 85 °C.
*2 : When mounted on a four-layer epoxy board of 11.7 cm × 8.4 cm
*3 : IC is mounted on a four-layer epoxy board, which has thermal via, and the IC's thermal pad is connected to the
epoxy board (Thermal via is 9 holes).
*4 : IC is mounted on a four-layer epoxy board, which has no thermal via, and the IC's thermal pad is connected
to the epoxy board.
Notes: • The use of negative voltages below − 0.3 V to the AGND, DGND1, and DGND2 pin may create parasitic
transistors on LSI lines, which can cause abnormal operation.
• This device can be damaged if the LX pins are short-circuited to AVDD and DVDD1/DVDD2, or AGND and
DGND1/DGND2.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
DS04-27246-2E
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