MB85R1002A Datasheet, PDF (13/16 Pages) Fujitsu Component Limited. – Memory FRAM CMOS 1 M Bit (64 K x 16)

MB85R1002A
■ PACKAGE DIMENSIONS
48-pin plastic TSOP
(FPT-48P-M48)
Lead pitch
Package width ×
package length
Lead shape
Sealing method
Mounting height
Weight
0.50 mm
12.00 mm × 12.40 mm
Gullwing
Plastic mold
1.20 mm MAX
0.36 g
48-pin plastic TSOP
(FPT-48P-M48)
1
INDEX
Note 1) # : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2) * : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.10±0.05 (.004±.002)
(STAND OFF)
48
0.50(.020)
#12.00±0.10
(.472±.004)
24
14.00±0.20(.551±.008)
*12.40±0.10(.488±.004)
25
1.13±0.07 (.044±.003)
(MOUNTING HEIGHT)
0.145
+0.05
–0.03
(.006
+.002
–.001
)
0.08(.003)
A
C _{2010 FUJITSU SEMICONDUCTOR LIMITED F48048Sc-1-1}
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
0.22
+0.05
–0.04
(.009
+.002
–.002
)
0.10(.004) M
Details of A part
0.25(.010)
0.60±0.15
0~8
(.024±.006)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
DS501-00004-0v01-E
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