S9S08SC4E0MTG Datasheet, PDF (9/31 Pages) Freescale Semiconductor, Inc – MC9S08SC4 8-Bit Microcontroller Data Sheet

Chapter 3 Electrical Characteristics
1 _{Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting}
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
2 _{Junction to Ambient Natural Convection}
The average chip-junction temperature (T_J) in °C can be obtained from:
where:
T_J = T_A + (P_D × θ_JA)
Eqn. 3-1
T_A = Ambient temperature, °C
θ_JA = Package thermal resistance, junction-to-ambient, °C/W
P_D = P_int + P_I/O
P_int = I_DD × V_DD, Watts — chip internal power
P_I/O = Power dissipation on input and output pins — user determined
For most applications, P_I/O << P_int and can be neglected. An approximate relationship between P_D and T_J (if P_I/O is neglected)
is:
P_D = K ÷ (T_J + 273°C)
Solving Equation 3-1 and Equation 3-2 for K gives:
Eqn. 3-2
K = P_D × (T_A + 273°C) + θ_JA × (P_D)²
Eqn. 3-3
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring P_D (at equilibrium)
for a known T_A. Using this value of K, the values of P_D and T_J can be obtained by solving Equation 3-1 and Equation 3-2
iteratively for any value of T_A
3.5 ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits,
normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure
that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. During
the device qualification ESD stresses were performed for the human body model (HBM) and the charge device model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete
DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
Table 3-4. ESD and Latch-up Test Conditions
Model
Human
Body
Latch-up
Description
Series resistance
Storage capacitance
Number of pulses per pin
Minimum input voltage limit
Maximum input voltage limit
Symbol
R1
C
—
—
—
Value
1500
100
3
–2.5
7.5
Unit
Ω
pF
—
V
V
MC9S08SC4 MCU Series Data Sheet, Rev. 4
Freescale Semiconductor
9