34704_11 Datasheet, PDF (8/54 Pages) Freescale Semiconductor, Inc – Multiple Channel DC-DC Power Management IC

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Battery Input Supply Voltage (VIN) Pin
V_IN
-0.3 to 6.0
V
PVINx, RST, ONOFF, LION, DRV7⁽⁸⁾, VG, SCL, SDA and VOUT1-5 Pins
-0.3 to 6.0
VDDI, COMPx, FBx, VREF7⁽⁸⁾, FREQ, and SS Pins
-0.3 to 3.0
SW1-5 Pins
SW8, SW6⁽⁸⁾ Pins
BTx Pins (Referenced to switch node)
BTx Pins to GND
VOUT8, VOUT6⁽⁸⁾ Pins
VOUT7 Pin⁽⁸⁾
Continuous Output Current
REG1⁽⁸⁾
REG2,5
REG3
REG4
REG6,7⁽⁸⁾
REG8
V_SW-LOW
-1.0 to 6.0
V
V_SW-HIGH
-1.0 to 27
V
V_BT-V_SW
-0.3 to 6.0
V
V_BT
-0.3 to 27
V
V_OUT-HIGH
-0.3 to 27
V
V_OUT-NEG
-10.0 to 0.3
V
mA
500
500
550
300
60
30
ESD Voltage
Human Body Model
Charge Device Model
THERMAL RATINGS
V
V_ESD1
V_ESD2
±1000
±500
Maximum Junction Temperature
Storage Temperature
Maximum Power Dissipation (T_A = 85°C)
THERMAL RESISTANCE⁽⁷⁾
T_J(MAX)
+150
°C
T_STG
-65 to +150
°C
PD
2.5
W
Thermal Resistance
Junction to Ambient
Junction to Board
Peak Package Reflow Temperature During Reflow^(5),(6)
R_ΘJA
R_ΘJB
T_PPRT
26
10
Note 6
°C/W
°C
Notes
4. ESD testing is performed in accordance with the Human Body Model (HBM) (C_ZAP = 100 pF, R_ZAP = 1500 Ω), and the Charge Device
Model (CDM), Robotic (C_ZAP = 4.0 pF).
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
7. Thermal Resistance is based on a four-layer board (2s2p)
8. Available only on the 34704A
34704
8
Analog Integrated Circuit Device Data
Freescale Semiconductor