33797 Datasheet, PDF (5/34 Pages) Freescale Semiconductor, Inc – Four Channel Squib Driver IC

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
INPUT ELECTRICAL RATINGS
Voltage on VDD
V_DD
7.0
V
Voltage on Input pins CS, CLK, D1, D0, FEN_1, FEN_2, RESETB,
V_I
R_DIAG, R_LIMIT_X
V
-0.3 to V_DD + 0.3
Voltage on Squib pins SQB_HI_XX, SQB_LO_XX, SENSE_XX
V_{VFIRE_XX}
-0.3 to V_VFIRE + 0.3
V
Voltage on pins VDIAG_X, VFIRE_XX
VDIAG_X
-0.3 to 35
V
ESD Voltage ⁽¹⁾
Human Body Model
Machine Model
Maximum V_VFIRE with Pulsed Output ^{(2), (3)}
R_SQUIB = 2.0 Ω, t_ON = 0.8 ms, I_SQUIB = 2.24 A
R_SQUIB = 1.2 Ω, t_ON = 0.8 ms, I_SQUIB = 2.24 A
R_SQUIB = 0.1 Ω, t_ON = 0.60 ms, I_SQUIB = 2.24 A
V
V_ESD1
V_ESD2
±2000
±200
V_FPULSE
V
35
25
25
THERMAL RATINGS
Storage Temperature
T_STG
155
°C
Junction Temperature Ambient
Continuous (Prior to Squib Deployment)
t ≤ 5.0 ms (Post-Squib Deployment)
T_A
T_JCONT
T_JDPYD
85
°C
100
300
Peak Package Reflow Temperature During Reflow ⁽⁴⁾, ⁽⁵⁾
T_PPRT
Note 5.
°C
Thermal Resistance (Junction-to-Ambient)
R_θJ-A
74
°C/W
Notes
1 ESD1 testing is performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (C_ZAP = 200 pF, R_ZAP = 0 Ω).
2 With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.
The individual squib driver thermal shutdown will not affect other squib driver firing “ON” times. With a shorted squib load, the FET squib
driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is
exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the
arm / fire command when the TEMP_RENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load is 2.15 Ω ± 0.15 Ω.
Shorted squib load is 0.1 Ω.
3 Three-squib driver with R_SQUIB = 0.1 Ω conditions. Remaining squib driver conditions: R_SQUIB = 1.2 Ω, t_ON = 4.0 ms, I_SQUIB = 2.0 A,
V_{VDIAG_X} = V_{VFIRE_XX} = 35 V.
4 Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33797
5