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K20P144M100SF2_1109 Datasheet, PDF (33/74 Pages) Freescale Semiconductor, Inc – K20 Sub-Family Data Sheet
6.4.1.2
Peripheral operating requirements and behaviors
Flash timing specifications — commands
Table 21. Flash command timing specifications
Symbol Description
Read 1s Block execution time
trd1blk256k
• 256 KB program/data flash
Min.
—
Typ.
—
Max.
1.7
Unit
Notes
ms
trd1sec2k Read 1s Section execution time (flash sector)
—
—
60
μs
1
tpgmchk Program Check execution time
—
—
45
μs
1
trdrsrc Read Resource execution time
—
—
30
μs
1
tpgm4 Program Longword execution time
—
65
145
μs
Erase Flash Block execution time
2
tersblk256k
• 256 KB program/data flash
—
435
3700
ms
tersscr Erase Flash Sector execution time
Program Section execution time
tpgmsec512
tpgmsec1k
tpgmsec2k
• 512 B flash
• 1 KB flash
• 2 KB flash
trd1all Read 1s All Blocks execution time
trdonce Read Once execution time
tpgmonce Program Once execution time
tersall Erase All Blocks execution time
tvfykey Verify Backdoor Access Key execution time
Swap Control execution time
tswapx01
tswapx02
tswapx04
tswapx08
• control code 0x01
• control code 0x02
• control code 0x04
• control code 0x08
—
14
114
ms
2
—
2.4
—
ms
—
4.7
—
ms
—
9.3
—
ms
—
—
1.8
ms
—
—
25
μs
1
—
65
—
μs
—
870
7400
ms
2
—
—
30
μs
1
—
200
—
μs
—
70
150
μs
—
70
150
μs
—
—
30
μs
1. Assumes 25MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
6.4.1.3 Flash (FTFL) current and power specfications
Table 22. Flash (FTFL) current and power specfications
Symbol
IDD_PGM
Description
Worst case programming current in program flash
Typ.
Unit
10
mA
K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Freescale Semiconductor, Inc.
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