K20P144M100SF2_1109 Datasheet, PDF (22/74 Pages) Freescale Semiconductor, Inc – K20 Sub-Family Data Sheet

General
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.4.2 Thermal attributes
Board type Symbol
Single-layer
(1s)
R_θJA
Four-layer
(2s2p)
R_θJA
Single-layer
(1s)
R_θJMA
Four-layer
(2s2p)
R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description 144 LQFP
Thermal
45
resistance,
junction to
ambient (natural
convection)
Thermal
36
resistance,
junction to
ambient (natural
convection)
Thermal
36
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
30
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
24
resistance,
junction to
board
Thermal
9
resistance,
junction to case
Thermal
2
characterization
parameter,
junction to
package top
outside center
(natural
convection)
144
MAPBGA
48
Unit
°C/W
29
°C/W
38
°C/W
25
°C/W
16
°C/W
9
°C/W
2
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
22
Freescale Semiconductor, Inc.