MC9S08AC16_09 Datasheet, PDF (294/330 Pages) Freescale Semiconductor, Inc – HCS08 Microcontrollers

Appendix A Electrical Characteristics and Timing Specifications
Table A-2. Absolute Maximum Ratings (continued)
Rating
Symbol
Value
Unit
Instantaneous maximum current
Single pin limit (applies to all port pins)¹, ², ³
I_D
± 25
mA
Maximum current into V_DD
I_DD
120
mA
Storage temperature
T_stg
–55 to +150
°C
Maximum junction temperature
T_J
150
°C
1 _{Input must be current limited to the value specified. To determine the value of the required}
current-limiting resistor, calculate resistance values for positive (V_DD) and negative (V_SS) clamp
voltages, then use the larger of the two resistance values.
2 _{All functional non-supply pins are internally clamped to VSS and VDD.}
3 _{Power supply must maintain regulation within operating VDD range during instantaneous and}
operating maximum current conditions. If positive injection current (V_In > V_DD) is greater than
I_DD, the injection current may flow out of V_DD and could result in external power supply going
out of regulation. Ensure external V_DD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low which would reduce overall power
consumption.
A.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
P_I/O into account in power calculations, determine the difference between actual pin voltage and V_SS or
V_DD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
loads), the difference between pin voltage and V_SS or V_DD will be very small.
Table A-3. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
Thermal resistance ^1,2,3,4
T_A
T_L to T_H
°C
–40 to 125
48-pin QFN
1s
84
2s2p
27
44-pin LQFP
32-pin LQFP
1s
2s2p
θ_JA
1s
2s2p
73
56
°C/W
85
56
42-pin SDIP
1s
58
2s2p
47
1 _{Junction temperature is a function of die size, on-chip power dissipation, package thermal}
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance.
MC9S08AC16 Series Data Sheet, Rev. 8
294
Freescale Semiconductor