33982B_09 Datasheet, PDF (29/36 Pages) Freescale Semiconductor, Inc – Single Intelligent High-current Self-protected Silicon High Side Switch (2.0 mΩ)

PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
SOLDERING INFORMATION
The 33982 is packaged in a surface mount power package
intended to be soldered directly on the printed circuit board.
The 33982 was qualified in accordance with JEDEC
standards JESD22-A113-B and J-STD-020A. The
recommended reflow conditions are as follows:
• Convection: 225°C +5.0/-0°C
• Vapor Phase Reflow (VPR): 215°C to 219°C
• Infrared (IR)/Convection: 225°C +5.0/-0°C
The maximum peak temperature during the soldering
process should not exceed 230°C. The time at maximum
temperature should range from 10 to 40 s maximum.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33982
29