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MRF377HR3_09 Datasheet, PDF (2/14 Pages) Freescale Semiconductor, Inc – RF Power Field-Effect Transistor N-Channel Enhancement-Mode Lateral MOSFET
Table 3. ESD Protection Characteristics
Test Conditions
Human Body Model
Machine Model
Charge Device Model
Table 4. Electrical Characteristics (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Off Characteristics (1)
Drain - Source Breakdown Voltage (4)
(VGS = 0 Vdc, ID =10 μA)
V(BR)DSS
65
Zero Gate Voltage Drain Current (4)
(VDS = 32 Vdc, VGS = 0 Vdc)
IDSS
—
Gate - Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
IGSS
—
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 200 μA)
VGS(th)
—
On Characteristics
Gate Quiescent Voltage (3)
(VDS = 32 Vdc, ID = 2000 mAdc)
VGS(Q)
2.5
Drain - Source On - Voltage (1)
(VGS = 10 Vdc, ID = 3 A)
VDS(on)
—
Dynamic Characteristics (1,2)
Reverse Transfer Capacitance
(VDS = 28 Vdc, VGS = 0, f = 1 MHz)
Crss
—
Functional Tests (3) (In DVBT OFDM Single - Channel, Narrowband Fixture, 50 ohm system)
Common Source Power Gain
(VDD = 32 Vdc, Pout = 45 W Avg., IDQ = 2000 mA,
f = 860 MHz)
Gps
16.5
Drain Efficiency
(VDD = 32 Vdc, Pout = 45 W Avg., IDQ = 2000 mA,
f = 860 MHz)
ηD
21
Adjacent Channel Power Ratio
(VDD = 32 Vdc, Pout = 45 W Avg., IDQ = 2000 mA,
f = 860 MHz)
ACPR
—
Typical Performances (3) (In DVBT OFDM Single - Channel, Broadband Fixture, 50 ohm system)
Common Source Power Gain
(VDD = 32 Vdc, Pout = 45 W Avg., IDQ = 2000 mA)
f = 470 MHz
f = 560 MHz
f = 660 MHz
f = 760 MHz
f = 860 MHz
Gps
—
—
—
—
—
1. Each side of device measured separately.
2. Part is internally matched both on input and output.
3. Measurement made with device in push - pull configuration.
4. Drains are tied together internally as this is a total device value.
Class
1 (Minimum)
M3 (Minimum)
7 (Minimum)
Typ
Max
—
—
—
1
—
1
2.8
—
3.5
4.5
0.27
—
3.2
—
18.2
—
22.9
—
- 59.2
- 57
17.6
—
17.6
—
17.4
—
17.4
—
16.8
—
Unit
Vdc
μAdc
μAdc
Vdc
Vdc
Vdc
pF
dB
%
dBc
dB
(continued)
MRF377HR3
2
RF Device Data
Freescale Semiconductor