K30P81M100SF2_11 Datasheet, PDF (2/62 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

Table of Contents
1 Ordering parts...........................................................................3
5.3.2 Thermal attributes.................................................18
1.1 Determining valid orderable parts......................................3
6 Peripheral operating requirements and behaviors....................19
2 Part identification......................................................................3
6.1 Core modules....................................................................19
2.1 Description.........................................................................3
6.1.1 Debug trace timing specifications.........................19
2.2 Format...............................................................................3
6.1.2 JTAG electricals....................................................20
2.3 Fields.................................................................................3
6.2 System modules................................................................23
2.4 Example............................................................................4
6.3 Clock modules...................................................................23
3 Terminology and guidelines......................................................4
6.3.1 MCG specifications...............................................23
3.1 Definition: Operating requirement......................................4
6.3.2 Oscillator electrical specifications.........................26
3.2 Definition: Operating behavior...........................................5
6.3.3 32kHz Oscillator Electrical Characteristics............28
3.3 Definition: Attribute............................................................5
6.4 Memories and memory interfaces.....................................28
3.4 Definition: Rating...............................................................6
6.4.1 Flash (FTFL) electrical specifications....................29
3.5 Result of exceeding a rating..............................................6
6.4.2 EzPort Switching Specifications............................30
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................31
requirements......................................................................6
6.6 Analog...............................................................................31
3.7 Guidelines for ratings and operating requirements............7
6.6.1 ADC electrical specifications.................................31
3.8 Definition: Typical value.....................................................7
6.6.2 CMP and 6-bit DAC electrical specifications.........38
3.9 Typical value conditions....................................................8
6.6.3 12-bit DAC electrical characteristics.....................41
4 Ratings......................................................................................8
6.6.4 Voltage reference electrical specifications............44
4.1 Thermal handling ratings...................................................9
6.7 Timers................................................................................45
4.2 Moisture handling ratings..................................................9
6.8 Communication interfaces.................................................45
4.3 ESD handling ratings.........................................................9
6.8.1 CAN switching specifications................................46
4.4 Voltage and current operating ratings...............................9
6.8.2 DSPI switching specifications (low-speed mode)..46
5 General.....................................................................................10
6.8.3 DSPI switching specifications (high-speed mode) 47
5.1 Nonswitching electrical specifications...............................10
6.8.4 I2C switching specifications..................................49
5.1.1 Voltage and current operating requirements.........10
6.8.5 UART switching specifications..............................49
5.1.2 LVD and POR operating requirements.................11
6.8.6 SDHC specifications.............................................49
5.1.3 Voltage and current operating behaviors..............11
6.8.7 I2S switching specifications..................................50
5.1.4 Power mode transition operating behaviors..........12
6.9 Human-machine interfaces (HMI)......................................52
5.1.5 Power consumption operating behaviors..............13
6.9.1 TSI electrical specifications...................................52
5.1.6 EMC radiated emissions operating behaviors.......16
6.9.2 LCD electrical characteristics................................53
5.1.7 Designing with radiated emissions in mind...........17
7 Dimensions...............................................................................54
5.1.8 Capacitance attributes..........................................17
7.1 Obtaining package dimensions.........................................54
5.2 Switching specifications.....................................................17
8 Pinout........................................................................................54
5.2.1 Device clock specifications...................................17
8.1 K30 Signal Multiplexing and Pin Assignments..................54
5.2.2 General switching specifications...........................17
8.2 K30 Pinouts.......................................................................58
5.3 Thermal specifications.......................................................18
9 Revision History........................................................................60
5.3.1 Thermal operating requirements...........................18
K30 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.