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K30P144M100SF2_1109 Datasheet, PDF (19/72 Pages) Freescale Semiconductor, Inc – K30 Sub-Family Data Sheet
General
2. VDD = 3.3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz, fBUS = 48 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
CIN_A
CIN_D
Description
Input capacitance: analog pins
Input capacitance: digital pins
Min.
Max.
Unit
—
7
pF
—
7
pF
5.3 Switching specifications
5.3.1 Device clock specifications
Table 9. Device clock specifications
Symbol Description
fSYS
fBUS
FB_CLK
fFLASH
fLPTMR
System and core clock
Bus clock
FlexBus clock
Flash clock
LPTMR clock
Normal run mode
Min.
—
—
—
—
—
Max.
100
50
50
25
25
Unit
MHz
MHz
MHz
MHz
MHz
Notes
5.3.2 General switching specifications
These general purpose specifications apply to all signals configured for GPIO, UART,
CAN, CMT, and I2C signals.
K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Freescale Semiconductor, Inc.
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