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MC9S08PT16 Datasheet, PDF (17/33 Pages) Freescale Semiconductor, Inc – MC9S08PT16
Rating
Operating temperature range TA
(packaged)
Junction temperature range TJ
44-pin LQFP
θJA
32-pin LQFP
θJA
20-pin SOIC
θJA
20-pin TSSOP
θJA
16-pin TSSOP
θJA
44-pin LQFP
θJA
32-pin LQFP
θJA
20-pin SOIC
θJA
20-pin TSSOP
θJA
16-pin TSSOP
θJA
Table 8. Thermal characteristics
Symbol
Value
TL to TH -40 to 105
-40 to 150
Thermal resistance single-layer board
76
88
82
116
130
Thermal resistance four-layer board
54
59
54
76
87
Thermal specifications
Unit
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts - chip internal power
PI/O = Power dissipation on input and output pins - user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship
between PD and TJ (if PI/O is neglected) is:
PD = K ÷ (TJ + 273 °C)
Solving the equations above for K gives:
K = PD × (TA + 273 °C) + θJA × (PD)2
where K is a constant pertaining to the particular part. K can be determined by measuring
PD (at equilibrium) for an known TA. Using this value of K, the values of PD and TJ can
be obtained by solving the above equations iteratively for any value of TA.
MC9S08PT16 Series Data Sheet, Rev. 1, 7/4/2012.
Freescale Semiconductor, Inc.
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