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MC9S08PT16 Datasheet, PDF (16/33 Pages) Freescale Semiconductor, Inc – MC9S08PT16

Thermal specifications

Table 7. FTM input timing (continued)
No.
C
Function
Symbol
Min
Max
Unit
2
D
External clock
tTCLK
4
—
tcyc
period
3
D
External clock
tclkh 
1.5

—
tcyc
high time
4
D
External clock
tclkl
1.5
—
tcyc
low time
5
D
Input capture
tICPW
1.5
—
tcyc
pulse width


tclkh
tTCLK
TCLK
tclkl
Figure 9. Timer external clock
tICPW
FTMCHn
FTMCHn
tICPW
Figure 10. Timer input capture pulse
5.3 Thermal specifications
5.3.1 Thermal characteristics
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take PI/O into account in
power calculations, determine the difference between actual pin voltage and VSS or VDD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin
current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
MC9S08PT16 Series Data Sheet, Rev. 1, 7/4/2012.
16
Freescale Semiconductor, Inc.