IMX35 Datasheet, PDF (1/148 Pages) Power-One – 35 Watt DC-DC Converters

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MCIMX35SR2AEC
Rev. 6, 10/2009
IMX35
i.MX35 Applications
Processors for
Automotive Products
Silicon Revisions 2.0 and 2.1
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The i.MX35 Auto Application Processor family is
designed for automotive infotainment and
navigation applications. These processors are
AECQ100 Grade 3 qualified and rated for ambient
operating temperatures up to 85 °C.
The i.MX35 multimedia applications processor
represents the next step in low-power,
high-performance application processors.
Based on an ARM11 microprocessor core running
at up to 532 MHz, the device offers the following
features and optimized system cost for the target
applications.
• Audio connectivity and telematics:
— Compressed audio playback from
storage devices (CD, USB, HDD or SD
card)
— PlayFromDevice (1-wire and 2-wire
support) for portable media players
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Functional Description and Application Information . . . . . 5
2.1 Application Processor Domain Overview. . . . . . . . . 5
2.2 Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3 Advanced Power Management Overview . . . . . . . . 6
2.4 ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 6
2.5 Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Signal Descriptions: Special Function Related Pins . . . . 12
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1 i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 13
4.2 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3 Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 19
4.6 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 20
4.7 I/O Pin DC Electrical Characteristics . . . . . . . . . . . 22
4.8 I/O Pin AC Electrical Characteristics . . . . . . . . . . . 25
4.9 Module-Level AC Electrical Specifications. . . . . . . 31
5 Package Information and Pinout . . . . . . . . . . . . . . . . . . 132
5.1 MAPBGA Production Package 1568-01, 17 × 17 mm,
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
5.2 MAPBGA Signal Assignments. . . . . . . . . . . . . . . 134
6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . 147
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2008, 2009. All rights reserved.