FXLP4555MPX Datasheet, PDF (5/13 Pages) Fairchild Semiconductor – 1.8V / 3.0V SIM Card Power Supply and Level Shifter

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. T_A=+25°C.
Symbol
V_BAT
V_CCA
V_{CC_C}
V_IN
I_IN
V_OUT
I_OUT
V_{OUT_SIM}
I_{OUT_SIM}
P_D
Θ_JA
T_A
T_J
T_JMAX
T_STG
ESD
Parameter
LDO Power Supply Voltage
Power Supply from Baseband Side
External Card Power Supply
Digital Input Pin Voltage
Digital Input Pin Current
Digital Output Pin Voltage
Digital Output Pin Current
SIM Card Output Pin Voltage
SIM Card Output Pin Current⁽¹⁾
Power Dissipation at T_A=+85°C
Thermal Resistance, Junction-to-Air
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Electrostatic
Discharge
Capability
Human Body
Model,
JESD22-A114
R=1500Ω,
C=100pF
SIM Card Pins
(7,8,9,10,11)
All Other Pins
Min.
-0.5
-0.5
-0.5
-0.5
-5
-0.5
-10
-0.5
-40
-40
-65
Typ.
V_BAT
V_CCA
V_{CC_C}
V_IN
V_OUT
V_OUT
8000
Max.
6.0
6.0
6.0
V_CCA+0.5,
but <6.0
+5
V_CCA+0.5,
but <6.0
+10
SIM_V_CC+
0.5<6.0
15
440
72
+85
+125
+125
+150
Unit
V
V
V
V
mA
V
mA
V
mA
mW
°C/W
°C
°C
°C
°C
2000
V
Charged
SIM Card Pins
Device Model, ^{(7,8,9,10,11)}
JESD22-C101 _{All Other Pins}
Moisture Sensitivity Level
Notes:
1. Internally limited.
2. Meets or exceeds JEDEC specification EIA/JESD78 IC latchup test.
2000
600
1
Level
© 2010 Fairchild Semiconductor Corporation
FXLP4555 • Rev. 1.0.0
5
www.fairchildsemi.com