FXLP4555MPX Datasheet, PDF (12/13 Pages) Fairchild Semiconductor – 1.8V / 3.0V SIM Card Power Supply and Level Shifter

Physical Dimensions
Figure 13. 16-Lead, Molded Leadless Package (MLP), QUAD, JEDEC MO-220, 3mm Square
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/MLP16B.html.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packaging/3x3MLP16_Pack_TNR.pdf.
© 2010 Fairchild Semiconductor Corporation
FXLP4555 • Rev. 1.0.0
12
www.fairchildsemi.com