FAN48632 Datasheet, PDF (4/13 Pages) Fairchild Semiconductor – 2.5 MHz, 2.0 A Pulsed-Load Synchronous TinyBoost

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
Parameter
VIN
VOUT
VIN Input Voltage
VOUT Output Voltage
SW Node
DC
Transient: 10 ns, 3 MHz
Other Pins
ESD
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
TJ Junction Temperature
TSTG Storage Temperature
TL Lead Soldering Temperature, 10 Seconds
Note:
3. Lesser of 6.5 V or VIN + 0.3 V.
Min.
Max.
-0.3
6.5
6.0
-0.3
8.0
-1.0
8.0
-0.3
6.5⁽³⁾
3.0
1.5
–40
+150
–65
+150
+260
Unit
V
V
V
V
V
kV
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol
VIN Supply Voltage
IOUT Output Current
TA Ambient Temperature
TJ
Junction Temperature
Parameter
Min.
2.35
0
–40
–40
Max.
5.50
1500
+85
+125
Unit
V
mA
°C
°C
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
Fairchild evaluation boards (1 oz copper on all layers). Special attention must be paid not to exceed junction temperature TJ(max) at
a given ambient temperate TA.
Symbol
JA
JB
Parameter
Junction-to-Ambient Thermal Resistance
Junction-to-Board Thermal Resistance
Typical
80
42
Unit
°C/W
© 2013 Fairchild Semiconductor Corporation
FAN48632 • Rev. 1.0.3
4
www.fairchildsemi.com