FAN48632 Datasheet, PDF (12/13 Pages) Fairchild Semiconductor – 2.5 MHz, 2.0 A Pulsed-Load Synchronous TinyBoost

Physical Dimensions
0.03 C
2X
E
AF
B
BALL A1
INDEX AREA
D
0.03 C
2X
TOP VIEW
0.05 C
0.06 C
0.625
0.547
E
A1
0.40
0.40
(Ø0.21)
Cu Pad
(Ø0.30) Solder
Mask Opening
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.378±0.018
0.208±0.021
C
SEATING
PLANE ^D
SIDE VIEWS
0.40
0.40
1234
0.005 C A B
Ø0.260±0.02
16X
D
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE PER
ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE
SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS
586 ± 39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D,E,X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC016AF rev1
Figure 25. 16-Ball, 4x4 Array, 0.4 mm Pitch, 250 µm Ball, Wafer-Level Chip-Scale Package (WLCSP)
Product-Specific Dimensions
D
1.780 ±0.030
E
1.780 ±0.030
X
0.290
Y
0.290
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/UC/UC016AF.pdf
For current packing container specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-UC016AF.pdf
© 2013 Fairchild Semiconductor Corporation
FAN48632 • Rev. 1.0.3
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