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FAN2315MPX Datasheet, PDF (4/19 Pages) Fairchild Semiconductor – FAN2315 TinyBuck 15 A Integrated Synchronous Buck Regulator
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VPVIN
VIN
Parameter
Power Input
Modulator Input
VBOOT Boot Voltage
VSW
SW Voltage to GND
VBOOT
VPVCC
VVCC
VILIM
VFB
VEN
VSS
VFREQ
VPGOOD
Boot to SW Voltage
Boot to PGND
Gate Drive Supply Input
Controller Supply Input
Current Limit Input
Output Voltage Feedback
Enable Input
Soft Start Input
Frequency Input
Power Good Output
ESD Electrostatic Discharge
TJ
TSTG
Junction Temperature
Storage Temperature
Conditions
Referenced to PGND
Referenced to AGND
Referenced to PVCC
Referenced to PVCC, <20 ns
Referenced to PGND, AGND
Referenced to PGND, AGND < 20 ns
Referenced to SW
Referenced to PGND
Referenced to PGND, AGND
Referenced to PGND, AGND
Referenced to AGND
Referenced to AGND
Referenced to AGND
Referenced to AGND
Referenced to AGND
Referenced to AGND
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Min.
-0.3
-0.3
-0.3
-0.3
-1
-5
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-55
Max.
25.0
25.0
26.0
30.0
25
25
6.0
30.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
2000
2500
+150
+150
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VPVIN
VIN
TJ
ILOAD
VPVCC
Parameter
Power Input
Modulator Input
Junction Temperature
Load Current
Gate Drive Supply Input
Conditions
Referenced to PGND
Referenced to AGND
TA=25ºC, No Airflow
Referenced to PGND, AGND
Min.
4.5
4.5
-40
4.5
Max.
15.0
15.0
+125
20
5.5
Unit
V
V
°C
A
V
Thermal Characteristics
The thermal characteristics were evaluated on a 4-layer PCB structure (1 oz/1 oz/1 oz/1 oz) measuring 7 cm x 7 cm).
Symbol
ΘJA
ψJC
ψJPCB
Parameter
Thermal Resistance, Junction-to-Ambient
Thermal Characterization Parameter, Junction to Top of Case
Thermal Characterization Parameter, Junction-to-PCB
Max.
35
2.7
2.3
Unit
°C/W
°C/W
°C/W
© 2011 Fairchild Semiconductor Corporation
FAN2315 • Rev. 1.0.4
4
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