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FAN7392_10 Datasheet, PDF (16/18 Pages) Fairchild Semiconductor – High-Current, High- and Low-Side, Gate-Drive IC
Physical Dimensions
.
19.56
18.80
14
1
8
6.60
6.09
7
(1.74)
3.56
3.30
1.77
8.12
1.14
7.62
0.35
5.33 MAX
0.20
0.38 MIN
3.81
3.17
0.58
0.35
2.54
8.82
NOTES: UNLESS OTHERWISE SPECIFIED
THIS PACKAGE CONFORMS TO
A) JEDEC MS-001 VARIATION BA
B) ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONS ARE EXCLUSIVE OF BURRS,
C) MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) DIMENSIONS AND TOLERANCES PER
ASME Y14.5-1994
E) DRAWING FILE NAME: MKT-N14AREV7
Figure 39. 14-Lead Dual In-Line Package (DIP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FAN7392 Rev. 1.0.3
16
www.fairchildsemi.com