HBL5006 Datasheet, PDF (6/7 Pages) ON Semiconductor – LED Shunt HBL5006 Series

HBL5006 Series
PACKAGE DIMENSIONS
−X−
D
−Y−
E
1
2
2X b
0.08 M X Y
TOP VIEW
A
c
H_E
SIDE VIEW
2X L
SOD−523
CASE 502
ISSUE E
NOTES:
6. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
7. CONTROLLING DIMENSION: MILLIMETERS.
8. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
9. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.50 0.60 0.70
b
0.25 0.30 0.35
c
0.07 0.14 0.20
D 1.10 1.20 1.30
E 0.70 0.80 0.90
H E 1.50 1.60 1.70
L
0.30 REF
L2 0.15 0.20 0.25
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.48
1.80
2X
0.40
2X L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6