HBL5006 Datasheet, PDF (5/7 Pages) ON Semiconductor – LED Shunt HBL5006 Series

HBL5006 Series
DEVICE ORDERING INFORMATION
Device
Marking
Package
Shipping^†
HBL5006HT1G
SZHBL5006HT1G*
HD
SOD−323
HD
(Pb−Free)
3000 / Tape & Reel
HBL5006XV2T1G
SZHBL5006XV2T1G*
56
SOD−523
56
(Pb−Free)
3000 / Tape & Reel
HBL5006P2T5G
SZHBL5006P2T5G*
LD
SOD−923
LD
(Pb−Free)
8000 / Tape & Reel
†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
PACKAGE DIMENSIONS
H_E
D
b
1
2
E
C
L
NOTE 5
A1
NOTE 3
SOD−323
CASE 477−02
ISSUE H
A3
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
MILLIMETERS
DIM MIN NOM MAX
A 0.80 0.90 1.00
A1 0.00 0.05 0.10
A3
0.15 REF
b 0.25 0.32 0.4
C 0.089 0.12 0.177
D 1.60 1.70 1.80
E 1.15 1.25 1.35
L 0.08
H_E 2.30 2.50 2.70
INCHES
MIN NOM MAX
0.031 0.035 0.040
0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
SOLDERING FOOTPRINT*
0.63
0.025
1.60
0.063
2.85
0.112
0.83
0.033
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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