HBL5006 Datasheet, PDF (2/7 Pages) ON Semiconductor – LED Shunt HBL5006 Series

HBL5006 Series
MAXIMUM RATINGS
Rating
On−State Current, (T_A = 25°C) (Note 2)
SOD−323 (Note 1)
SOD−323 (Note 2)
Symbol
I_T(AVG)
Value
250
200
Unit
mA
SOD−523 (Note 1)
300
SOD−523 (Note 2)
250
Thermal Resistance, Junction−to−Air (All Packages)
SOD−923 (Note 1)
SOD−923 (Note 2)
SOD−323 (Note 1)
q_JA
SOD−323 (Note 2)
350
300
435
°C/W
550
SOD−523 (Note 1)
360
SOD−523 (Note 2)
435
SOD−923 (Note 1)
285
SOD−923 (Note 2)
360
Operating Temperature Range
Non−Operating Temperature Range
Lead Temperature, Soldering (10 Sec)
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
(Note 3)
T_J
−40 to 150
°C
T_J
150
°C
T_L
260
°C
ESD
±15
kV
ESD
±15
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted onto a 2−layer, 1000 mm² per layer, 3 oz Cu, FR4 PCB with pin 2 connected to the heat sink and pin 1 only connected to a signal
trace. The heat sinking must be connected to pin 2, which is the LED cathode connection.
Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the
HBL shunt would now dissipate the power using the same copper heat sink. Since the shunt has a voltage that is nominally 30% of the LED,
then the power dissipation would be much lower, and easily handled by the same heat sink as the LED.
2. Mounted onto a 2−layer, 50 mm² per layer, 1 oz Cu, FR4 PCB.
3. Max operating temperature for DC conditions is 150°C, but not to exceed 175°C for pulsed conditions with low duty cycle or non−repetitive.
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