1010L-002 Datasheet, PDF (6/9 Pages) List of Unclassifed Manufacturers – DIGITAL ACCELEROMETER

Model 1010 Digital Accelerometer
SOLDERING RECOMMENDATIONS (continued):
Reflow of Sn62 or Sn63 type solder using a hotplate is the preferred method for assembling the model 1010 surface mount
accelerometer to your Printed circuit board. Hand soldering using a fine tipped soldering iron is possible but difficult without
a steady hand and some form of visual magnification due to the small size of the connections. When using the hand solder
iron method, it’s best to purchase the J-Leaded version (1010J) for easier visual inspection of the finished solder joints.
Pre-Tinning of Accelerometer Leads is Recommended: To prevent gold migration embrittlement of the solder joints,
it is best to pre-tin the accelerometer leads. We recommend tinning one lead at a time, to prevent excessive heating of
the accelerometer, using a fine-tipped solder iron and solder wire. The solder bath method of pre-tinning is not
recommended due to the high degree of heat the interior of the device gets subjected to which may cause permanent shifts
in the bias and/or scale factor.
Hotplate Attach Method using Solder Paste or Solder Wire: Apply solder to the circuit board’s pads using Sn62 or Sn63
solder paste or pre-tin the pads using solder and a fine tipped soldering iron. If pre-tinning with an iron, apply flux to the
tinned pads prior to placing the components. Place the accelerometer in its proper position onto the pasted or tinned pads
then place the entire assembly onto a hotplate that has been pre-heated to 250EC. Leave on hotplate only long enough
for the solder to flow on all pads (DO NOT OVERHEAT!)
Solder Iron Attach Method using Solder Paste: Apply solder paste to the circuit board’s pads where the accelerometer
will be attached. Place the accelerometer in its proper position onto the pasted pads. Press gently on the top of the
accelerometer with an appropriate tool to keep it from moving and heat one of the corner pads, then an opposite corner
pad with the soldering iron. Make sure the accelerometer is positioned so all 20 of its connections are centered on the
board’s pads. Once the two opposite corner pads are soldered, the part is secure to the board and you can work your way
around soldering the remaining 18 connections. Allow the accelerometer to cool in between soldering each pin to prevent
overheating.
Solder Iron Attach Method using Solder Wire: Solder pre-tin two opposite corner pads on the circuit board where the
accelerometer will be attached. Place the accelerometer in its proper position onto the board. Press gently on the top of
the accelerometer and heat one of the corner pads that was tinned and the part will drop down through the solder and seat
on the board. Do the same at the opposite corner pad that was tinned. Make sure the accelerometer is positioned so all
20 of its connections are centered on the board’s pads. Once the two opposite corner pads are soldered, the part is secure
to the board and you can work your way around soldering the remaining 18 connections. Allow the accelerometer to cool
in between soldering each pin to prevent overheating.
LCC & JLCC Solder Contact Plating Information: The plating composition and thickness for the solder pads and
castellations on the “L” suffix (LCC) package are 60 to 225 micro-inches thick of gold (Au) over 80 to 350 micro-inches thick
of nickel (Ni) over a minimum of 5 micro-inches thick of moly-manganese or tungsten refractory material. The leads for
the “J” suffix (JLCC) package are made of an Iron-Nickel sealing alloy and have the same gold over nickel plating
thicknesses as for the LCC pads.
Recommended Solder Pad Pattern: The recommended solder pad size and shape for both the LCC and J-LCC
packages is shown in the diagram and table below. These dimensions are recommendations only and may or may not
be optimum for your particular soldering process.
DIM inch mm
A
.230 5.84
B
.430 10.92
C
.100 2.54
D
.033 0.84
E
.050 1.27
F
.013 0.33
G
.120 3.05
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Silicon Designs, Inc. ! 1445 NW Mall Street, Issaquah, WA 98027-5344 ! Phone: [phone] ! Fax: [phone]
web site: www.silicondesigns.com
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Mar 07