1010L-002 Datasheet, PDF (5/9 Pages) List of Unclassifed Manufacturers – DIGITAL ACCELEROMETER

Model 1010 Digital Accelerometer
BIAS STABILITY CONSIDERATIONS
Bias temperature hysteresis can be minimized by temperature cycling your model 1010 accelerometer after it has
been soldered to your circuit board. If possible, the assembled device should be exposed to ten cycles from -40 to
+85EC minimum (-55 to +125EC recommended). The orientation to the Earth's gravitational field during temperature
cycling should preferably be in the same orientation as it will be in the final application. The accelerometer does not
need to have power applied during this temperature cycling.
PACKAGE DIMENSIONS
"L" SUFFIX PACKAGE (20 PIN LEADLESS CERAMIC CHIP CARRIER)
*T
C
*M
F
INCHES
MILLIMETERS
K
DIM
MIN MAX MIN MAX
A 0.342 0.358 8.69 9.09
Positive
Acceleration
B 0.346 0.378 8.79 9.60
E
TERMINAL 20
C
0.055 TYP
1.40 TYP
TERMINAL 1
D 0.095 0.115 2.41 2.92
E 0.085 TYP
2.16 TYP
F 0.050 BSC
1.27 BSC
A
D
G
G 0.025 TYP
H 0.050 TYP
0.64 TYP
1.27 TYP
"J" SUFFIX PACKAGE (20 PIN LEADED CHIP CARRIER)
R
J 0.004 x 45°
K 0.010 R TYP
0.10 x 45°
0.25 R TYP
L
0.016 TYP
0.41 TYP
* M 0.048 TYP
1.23 TYP
N 0.050 0.070 1.27 1.78
P 0.017 TYP
0.43 TYP
R 0.023 R TYP
0.58 R TYP
* T 0.085 TYP
2.16 TYP
N
* U 0.175 TYP
4.45 TYP
NOTES: 1. * DIMENSIONS 'M', 'T' & 'U' LOCATE ACCELERATION SENSING ELEMENT'S CENTER OF MASS .
2. LID IS ELECTRICALLY TIED TO TERMINAL 19 (GND).
3. CONTROLLING DIMENSION: INCH.
4. TERMINALS ARE PLATED WITH 60 MICRO-INCHES MIN GOLD OVER 80 MICRO-INCHES MIN NICKEL.
(THIS PLATING SPECIFICATION DOES NOT APPLY TO THE METALLIZED PIN-1 IDENTIFIER MARK ON
THE BOTTOM OF THE J-LEAD VERSION OF THE PACKAGE).
5. PACKAGE: 90% MINIMUM ALUMINA (BLACK), LID: SOLDER SEALED KOVAR.
SOLDERING RECOMMENDATIONS:
RoHS Compliance: The model 1010 does not contain elemental lead and is RoHS compliant.
WARNING: If no-lead solder is to be used to attach the device, we do not recommend the use of reflow soldering
methods such as vapor phase, solder wave or hot plate. These methods impart too much heat for too long of a
period of time and may cause excessive bias shifts. For no-lead soldering, we only recommend the manual "Solder
Iron Attach" method (listed on the next page of this data sheet). We also do not recommend the use of ultrasonic
bath cleaners because these models contain internal gold wires that are thermo sonically bonded.
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Silicon Designs, Inc. ! 1445 NW Mall Street, Issaquah, WA 98027-5344 ! Phone: [phone] ! Fax: [phone]
web site: www.silicondesigns.com
[page 5]
Mar 07